The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 1994
Filed:
May. 13, 1993
Leena P Buchwalter, Wappingers Falls, NY (US);
Stephen L Buchwalter, Wappingers Falls, NY (US);
Charles R Davis, Endicott, NY (US);
Ronald D Goldblatt, Rye Brook, NY (US);
John E Heidenreich, III, Yorktown Heights, NY (US);
Sharon L Nunes, Hopewell Junction, NY (US);
Jae M Park, Somers, NY (US);
Richard R Thomas, Fishkill, NY (US);
Domenico Tortorella, Yonkers, NY (US);
Luis M Ferreiro, deceased, late of Bartonia, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process is disclosed for producing a metal-organic polymer combination by contacting the polymer with a plasma followed by an aqueous solution of a metal salt. In one embodiment a water or nitrous oxide plasma is used to treat a polyimide or a fluorinated polymer. The polymer is combined with a metal cation, the metal being a catalyst for a conventional electroless coating after which it is contacted with an electroless metal plating bath for the formation of electrical circuits and especially for plating high aspect ratio vias in microcircuits. Unlike the conventional electroless process, the cationic catalytic metal is not reduced to a zero valent metal catalyst prior to the application of the electroless metal coating solution. The process also improves the wettability of the polymer, especially the fluorinated polymer and is especially useful in improving the wettability of high aspect ratio vias.