The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 1994
Filed:
May. 11, 1992
John Acocella, Hopewell Junction, NY (US);
Peter A Agostino, Canaan, NY (US);
Arnold I Baise, Wappingers Falls, NY (US);
Richard A Bates, Wappingers Falls, NY (US);
Ray M Bryant, Poughquag, NY (US);
Jon A Casey, Poughkeepsie, NY (US);
David R Clarke, Katonah, NY (US);
George Czornyj, Poughkeepsie, NY (US);
Allen J Dam, Pine Plains, NY (US);
Lawrence D David, Wappingers Falls, NY (US);
Renuka S Divakaruni, Ridgefield, CT (US);
Werner E Dunkel, LaGrangeville, NY (US);
Ajay P Giri, Poughkeepsie, NY (US);
Liang-Choo Hsia, Stormville, NY (US);
James N Humenik, LaGrangeville, NY (US);
Steven M Kandetzke, Poughkeepsie, NY (US);
Daniel P Kirby, Poughkeepsie, NY (US);
John U Knickerbocker, Hopewell Junction, NY (US);
Sarah H Knickerbocker, Hopewell Junction, NY (US);
Anthony Mastreani, Hopewell Junction, NY (US);
Amy T Matts, Poughkeepsie, NY (US);
Robert W Nufer, Hopewell Junction, NY (US);
Charles H Perry, Poughkeepsie, NY (US);
Srinivasa S Reddy, LaGrangeville, NY (US);
Salvatore J Scilla, Marlboro, NY (US);
Mark A Takacs, Poughkeepsie, NY (US);
Lovell B Wiggins, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.