The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 1990

Filed:

Nov. 01, 1989
Applicant:
Inventors:

Keiichi Yokota, Nirasaki, JP;

Ryuichi Takebuchi, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
414786 ; 437-8 ; 437924 ; 414754 ;
Abstract

A method of positioning a wafer when plural chips arranged on the semiconductor wafer are to be measured by a probe apparatus. The direction in which probes of the probe apparatus are set is measured via a dummy wafer and stored as data. The positioning of the wafer can be achieved by the operation of a table on which the wafer is mounted. When the wafer is to be positioned, the chips-lined direction on the wafer is rotated to align with the moving coordinates of the table and then with the probes-set direction. A probing direction in which wafers are successively moved and a reference position on the wafer are determined, and this reference position is aligned with the position of the probes. Measurement is carried out relative to every position of the chips calculated from the reference position, while moving the table along the probing direction.


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