The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 1989
Filed:
Mar. 29, 1988
Shin Kawakami, Saitama, JP;
Satoshi Haruyama, Saitama, JP;
Hirotaka Okonogi, Saitama, JP;
Katutomo Nikaido, Saitama, JP;
Norito Mukai, Saitama, JP;
Nippon CMK Corp., , JP;
Abstract
A printed circuit board comprises a base plate and a circuit conductor formed on at least one of the opposed surfaces of the base plate. A heat-radiating film is formed on at least a portion of the surface of the circuit conductor, and an insulating film is formed over the exposed surfaces of the heat-radiating film and the circuit conductor. At least one opening is formed in the insulating film, and the opening overlies the heat-radiating film thereby directly exposing the heat-radiating film to ambient atmosphere so as to promote dissipation of heat from the circuit conductor during use of the printed circuit board. The opening in the insulating film may be in the form of a slot or may comprise a pattern of circular or oval openings. The heat-radiating film may be copper or nickel paste, or non-organic material such as aluminum oxide.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile