The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 1989
Filed:
May. 10, 1988
Applicant:
Inventors:
Chang-Hwang Hua, Palo Alto, CA (US);
Ding-Yuan S Day, Sunnyvale, CA (US);
Simon S Chan, Belmont, CA (US);
Assignee:
Avantek, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
204 15 ;
Abstract
A method for simultaneous selective plating of viaholes and heat sinks associated with a semiconductor wafer using a metal mask and comprising the steps of:
Hua, Chang-Hwang. (1989). Method of selective via-hole and heat sink plating using a metal mask (U.S. Patent No. 4842699). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4842699
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile