The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 1989
Filed:
Feb. 17, 1988
Yasuhiro Teraoka, Itami, JP;
Tetsuya Ueda, Itami, JP;
Hideya Yagoura, Itami, JP;
Haruo Shimamoto, Itami, JP;
Shigeyuki Nango, Itami, JP;
Toshinobu Banjo, Itami, JP;
Hiroshi Seki, Itami, JP;
Abstract
A package structure comprising a metallic cap having a bottom wall to which the bottom surface of the semiconductor chip is electrically and mechanically connected, a side wall extending from said bottom wall and surrounding the semiconductor chip, and a flange extending outwardly from said side wall substantially parallel to said bottom wall, said flange supporting the lead conductors thereon through an electrically insulating material. The electrical connection means is disposed between the metallic cap flange and the lead conductor for establishing an electrical connection therebetween. The electrical connection means may comprise an electrically conductive projection formed on the flange of the metal cap, extending through a notch in the insulating material and electrically connected to the lead conductor. The electrical connection means may be an electrically conductive bonding material filled within a cavity defined by an opening in the flange of the metal cap, a through hole in the insulating material and a connecting pad of the lead conductor.