Company Filing History:
Years Active: 1989
Title: Shigeyuki Nango: Innovator in Semiconductor Packaging
Introduction
Shigeyuki Nango is a notable inventor based in Itami, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging structures. His innovative designs have paved the way for advancements in the efficiency and reliability of semiconductor devices.
Latest Patents
Nango holds 1 patent for a unique package structure for semiconductor devices. This patent describes a package structure that includes a metallic cap with a bottom wall, which is electrically and mechanically connected to the bottom surface of a semiconductor chip. The design features a side wall that surrounds the chip and a flange extending outwardly from the side wall. This flange supports lead conductors through an electrically insulating material, ensuring a reliable electrical connection.
Career Highlights
Shigeyuki Nango is associated with Mitsubishi Denki Kabushiki Kaisha, a prominent company in the electronics sector. His work has been instrumental in enhancing the performance of semiconductor devices, contributing to the company's reputation for innovation and quality.
Collaborations
Nango has collaborated with notable colleagues, including Yasuhiro Teraoka and Tetsuya Ueda. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor packaging.
Conclusion
Shigeyuki Nango's contributions to semiconductor packaging exemplify the spirit of innovation in technology. His patent and collaborative efforts continue to influence the industry, showcasing the importance of inventive minds in advancing modern electronics.