Itami, Japan

Yasuhiro Teraoka


Average Co-Inventor Count = 5.4

ph-index = 4

Forward Citations = 93(Granted Patents)


Company Filing History:


Years Active: 1989-1992

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4 patents (USPTO):Explore Patents

Title: Yasuhiro Teraoka: Innovator in Semiconductor Technology

Introduction

Yasuhiro Teraoka is a prominent inventor based in Itami, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative manufacturing methods that enhance the efficiency and performance of semiconductor devices.

Latest Patents

Teraoka's latest patents include a manufacturing method for semiconductor devices. This method involves electrically connecting an electrode of a semiconductor chip to an inner lead of a carrier tape. The electrodes of the semiconductor chip are brought into contact with the inner lead of the carrier tape, and bonding is performed with inner lead droop controlled to no more than 80 micrometers. Another notable patent is for a packaged semiconductor device that features an insulating film with an opening, a semiconductor chip disposed within the opening, and a heat radiator spaced from the chip. This innovative design encapsulates the semiconductor chip and part of the heat radiator while leaving a surface of the heat radiator externally exposed.

Career Highlights

Yasuhiro Teraoka is associated with Mitsubishi Electric Corporation, where he has been instrumental in advancing semiconductor technologies. His expertise and innovative approaches have led to the development of cutting-edge solutions in the industry.

Collaborations

Teraoka has collaborated with notable colleagues, including Tetsuya Ueda and Haruo Shimamoto. Their combined efforts have contributed to the success of various projects within the semiconductor field.

Conclusion

Yasuhiro Teraoka's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor manufacturing methods and device performance.

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