The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 1985
Filed:
Jan. 02, 1985
Masaru Nanpei, Mie, JP;
Akira Tomita, Shiga, JP;
Toshiaki Fujimura, Shiga, JP;
Kuniomi Etoh, Shiga, JP;
Toyo Boseki Kabnushiki Kaisha, Osaka, JP;
Abstract
The invention provides a photosensitive resin composition containing a soluble synthetic linear high-molecular compound in an amount of 25 to 95 weight percent based on the whole composition, a monomer having at least one photopolymerizable unsaturated bond and a photopolymerization initiator and characterized in that part or all of the soluble synthetic linear high-molecular compound is an addition polymer of an organic diisocyanate compound with an amide compound, both terminals of the amide compound being either primary or secondary amide groups and the equivalent ratio of amino groups to isocyanate groups in the addition polymer is not less than 1.0. The high-molecular weight compound makes up at least 50% by weight base on the total amount of the polymer material present in the composition.