The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
May. 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Fu-Wei Yao, Hsinchu City, TW;
Chun Lin Tsai, Hsin-Chu, TW;
Jiun-Lei Jerry Yu, Zhudong Township, TW;
Man-Ho Kwan, Kowloon, HK;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure relates to an integrated chip. The integrated chip includes a substrate. A doped isolation region is disposed within the substrate and includes a horizontally extending segment and one or more vertically extending segments extending outward from the horizontally extending segment. The substrate includes a first sidewall and a second sidewall separated from the first sidewall a non-zero distance. The non-zero distance is directly over the one or more vertically extending segments.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile