The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Jan. 09, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chuei-Tang Wang, Taichung City, TW;
Tso-Jung Chang, Taoyuan City, TW;
Wen-Shiang Liao, Miaoli County, TW;
Jeng-Shien Hsieh, Kaohsiung, TW;
Chih-Peng Lin, Hsinchu County, TW;
Shih-Ping Lin, Taichung City, TW;
Chieh-Yen Chen, Taipei City, TW;
Chen-Hua Yu, Hsinchu City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A package structure and a formation method are provided. The method includes bonding a first memory-containing chip structure to a second memory-containing chip structure through dielectric-to-dielectric bonding and metal-to-metal bonding. The method also includes bonding a logic control chip structure to the second memory-containing chip structure through dielectric-to-dielectric bonding and metal-to-metal bonding. The logic control chip structure is formed using a more advanced technology node than the second memory-containing chip structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile