The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Feb. 01, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masato Hamada, Kumamoto, JP;

Masami Akimoto, Koshi, JP;

Masatoshi Shiraishi, Kumamoto, JP;

Satoshi Kaneko, Koshi, JP;

Kazuki Motomatsu, Koshi, JP;

Kazuyuki Goto, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/12 (2006.01); C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
C25D 7/123 (2013.01); C25D 17/001 (2013.01);
Abstract

A plating method includes holding a substrate, supplying a plating liquid L, supplying a conductive liquid Land applying a voltage. In the holding of the substrate, the substrate is held. In the supplying of the plating liquid L, the plating liquid Lis supplied onto the held substrate. In the supplying of the conductive liquid L, the conductive liquid L, which is different from the plating liquid Lsupplied on the substrate, is supplied onto the plating liquid L. In the applying of the voltage, the voltage is applied between the substrate and the conductive liquid L


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Hamada, Masato. (2026). Plating method and plating apparatus (U.S. Patent No. 12790709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12790709

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