The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Aug. 22, 2024
Tokyo Electron Limited, Tokyo, JP;
Henry Jim Fulford, Marianna, FL (US);
Mark I. Gardner, Austin, TX (US);
Daniel Fulford, Albany, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of wafer handling includes providing a wafer on a wafer carrier on a wafer chuck on a vacuum plate. The wafer carrier includes a permanent magnet. The wafer chuck includes an electromagnet. The wafer is raised against a gravity direction by flowing an electrical current through the electromagnet so that the wafer carrier is repelled from the wafer chuck while the wafer remains on the wafer carrier. While keeping the wafer raised, wafer alignment is adjusted by moving the wafer chuck, the wafer carrier or both. The electrical current is reduced to zero so that the wafer carrier contacts the wafer chuck. The wafer is connected to the vacuum plate via a first vacuum cavity of the wafer chuck and a third vacuum cavity of the wafer carrier. The wafer carrier is connected to the vacuum plate via the second vacuum cavity of the wafer chuck.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile