The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Jun. 27, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yao-Sheng Huang, Kaohsiung City, TW;

I-Ming Chang, Hsinchu, TW;

Huang-Lin Chao, Hillsboro, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/01 (2026.01); H10D 30/01 (2025.01); H10D 30/67 (2025.01); H10D 62/00 (2026.01); H10D 62/10 (2025.01); H10D 62/80 (2025.01); H10D 62/832 (2025.01); H10D 64/01 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01); H10P 14/20 (2026.01); H10P 14/60 (2026.01);
U.S. Cl.
CPC ...
H10D 84/017 (2025.01); H10D 30/031 (2025.01); H10D 30/6713 (2025.01); H10D 30/6729 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/021 (2025.01); H10D 62/118 (2025.01); H10D 62/80 (2025.01); H10D 62/832 (2025.01); H10D 64/017 (2025.01); H10D 64/018 (2025.01); H10D 84/0167 (2025.01); H10D 84/0184 (2025.01); H10D 84/0186 (2025.01); H10D 84/038 (2025.01); H10D 84/85 (2025.01); H10P 14/3402 (2026.01); H10P 14/3411 (2026.01); H10P 14/3452 (2026.01); H10P 14/6308 (2026.01); H10P 14/6319 (2026.01);
Abstract

Embodiments of the present disclosure provide a method of forming N-type and P-type source/drain features using one patterned mask and one self-aligned mask to increase windows of error tolerance and provide flexibilities for source/drain features of various shapes and/or volumes. In some embodiments, after forming a first type of source/drain features, a self-aligned mask layer is formed over the first type of source/drain features without using photolithography process, thus, avoid damaging the first type of source/drain features in the patterning process.


Find Patent Forward Citations

Quick Actions:

Huang, Yao-Sheng. (2026). Method for forming epitaxial source/drain features using a self-aligned mask and semiconductor devices fabricated thereof (U.S. Patent No. 12787415). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787415

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