The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Jun. 25, 2024
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Guy Shwartz, Ramat-Gan, IL;

Ohr Lahad, Rehovot, IL;

Eran Erdal, Messilat Zion, IL;

Ido Almog, Rehovot, IL;

Lior Yaron, Ness Ziona, IL;

Ching-Hung Lai, Hsinchu, TW;

Ron Bar-Or, Ramat-Gan, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 17/20 (2006.01); G06T 7/00 (2017.01); G06T 7/50 (2017.01); G06T 7/62 (2017.01);
U.S. Cl.
CPC ...
G06T 17/20 (2013.01); G06T 7/0004 (2013.01); G06T 7/50 (2017.01); G06T 7/62 (2017.01); G06T 2207/10028 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01); G06T 2210/56 (2013.01);
Abstract

A method for generating a 3D reconstruction of structural elements of a wafer including: obtaining a 2D image of a top view of the plurality of structural elements, sectioned diagonally in a compound angle allowing 3D volumetric sampling, such that each of the plurality of structural elements is cut at a different height thereof, and generating a representative 3D reconstruction of the structural elements, based on the images.


Find Patent Forward Citations

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Shwartz, Guy. (2026). Algorithm for 3d reconstruction of diagonally cut semiconductor logic structure (U.S. Patent No. 12784364). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12784364

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