The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jun. 26, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Riichiro Endo, Miyagi, JP;

Takehiro Tanikawa, Miyagi, JP;

Kazuma Kita, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/72 (2026.01); H01J 37/32 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/722 (2026.01); H01J 37/3244 (2013.01); H01J 37/32724 (2013.01); H10P 72/0431 (2026.01); H10P 72/0602 (2026.01);
Abstract

A substrate-processing apparatus includes a substrate support that includes an electrostatic chuck, the electrostatic chuck including a support surface configured to support an annular member. The support surface includes a diffusion groove through which a heat transfer gas is diffused into a gap between the annular member and the support surface. The diffusion groove includes an annular groove provided concentrically with the electrostatic chuck; and a radial groove that is in communication with the annular groove and is provided from the annular groove in a radial direction of the electrostatic chuck.


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Endo, Riichiro. (2026). Substrate-processing apparatus (U.S. Patent No. 12777891). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777891

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