The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Jun. 11, 2024
Applicant:

Carl Zeiss Smt Gmbh, Oberkochen, DE;

Inventors:

Dmitry Klochkov, Schwäbisch Gmünd, DE;

Jens Timo Neumann, Aalen, DE;

Thomas Korb, Schwäbisch Gmünd, DE;

Eugen Foca, Ellwangen, DE;

Amir Avishai, Pleasanton, CA (US);

Alex Buxbaum, San Ramon, CA (US);

Assignee:

Carl Zeiss SMT GmbH, Oberkochen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 23/2206 (2018.01);
U.S. Cl.
CPC ...
G01N 23/2206 (2013.01);
Abstract

A system and a method for volume inspection of semiconductor wafers with increased throughput are configured for milling and imaging a reduced number or areas of appropriate cross-sections surfaces in an inspection volume and determining inspection parameters of the 3D objects from the cross-section surface images. The method and device can be utilized for quantitative metrology, defect detection, process monitoring, defect review, and inspection of integrated circuits within semiconductor wafers.


Find Patent Forward Citations

Klochkov, Dmitry. (2026). Method of 3d volume inspection of semiconductor wafers with increased throughput (U.S. Patent No. 12768804). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12768804

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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