The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Dec. 01, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Sai-Hooi Yeong, Hsinchu County, TW;

Kai-Hsuan Lee, Hsinchu City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 62/13 (2025.01); H10D 84/01 (2025.01); H10D 84/85 (2025.01); H10W 20/00 (2026.01); H10W 20/46 (2026.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 62/151 (2025.01); H10D 84/017 (2025.01); H10D 84/0186 (2025.01); H10D 84/0193 (2025.01); H10D 84/853 (2025.01); H10W 20/069 (2026.01); H10W 20/072 (2026.01); H10W 20/46 (2026.01);
Abstract

A method of forming a device includes providing a transistor having a gate structure and a source/drain structure adjacent to the gate structure. A cavity is formed along a sidewall surface of a contact opening over the source/drain structure. After forming the cavity, a sacrificial layer is deposited over a bottom surface and along the sidewall surface of the contact opening including within the cavity. A first portion of the sacrificial layer along the bottom surface of the contact opening is removed to expose a portion of the source/drain structure. A metal plug is then formed over the portion of the exposed source/drain structure. A remaining portion of the sacrificial layer is removed to form an air gap disposed between the metal plug and the gate structure. Thereafter, a seal layer is deposited over the air gap to form an air gap spacer.


Find Patent Forward Citations

Yeong, Sai-Hooi. (2026). Contact air gap formation and structures thereof (U.S. Patent No. 12765043). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765043

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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