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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12760248 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Oct. 16, 2023

Cleaning agent composition for substrate for semiconductor devices and method for cleaning substrate for semiconductor devices using the same

Applicants:

Enf Technology Co., Ltd., Yongin-si, KR;

SK Hynix Inc., Icheon-si, KR;

Inventors:

Hye Ji Kim, Yongin-si, KR;

Jinho You, Yongin-si, KR;

Hag Sung Lee, Yongin-si, KR;

Myungho Lee, Yongin-si, KR;

Narae Yim, Icheon-si, KR;

Yu Jin Heo, Icheon-si, KR;

Keon Young Kim, Icheon-si, KR;

Yun Sun Choi, Icheon-si, KR;

Young Mee Kang, Icheon-si, KR;

Assignees:

ENF TECHNOLOGY CO., LTD., Yongin-si, KR;

SK HYNIX INC., Icheon-si, KR;

Attorney:

McCoy Russell LLP

Primary Examiner:

Gregory R Delcotto

Int. Cl.
CPC ...
C11D 3/26 (2006.01); C11D 1/00 (2006.01); C11D 3/16 (2006.01); C11D 3/20 (2006.01); C11D 3/28 (2006.01); C11D 3/30 (2006.01); C11D 3/32 (2006.01); C11D 7/26 (2006.01); C11D 7/28 (2006.01); C11D 7/32 (2006.01); C11D 7/50 (2006.01); H10P 70/00 (2026.01);
U.S. Cl.
CPC ...
C11D 7/3209 (2013.01); C11D 1/004 (2013.01); C11D 3/162 (2013.01); C11D 3/2072 (2013.01); C11D 3/2093 (2013.01); C11D 3/30 (2013.01); C11D 3/32 (2013.01); C11D 7/265 (2013.01); C11D 7/28 (2013.01); C11D 7/3281 (2013.01); C11D 7/5022 (2013.01); H10P 70/20 (2026.01); C11D 2111/22 (2024.01);
Abstract

The present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device and a method for cleaning a substrate for a semiconductor device using the same. The cleaning agent composition contains a silicon-based compound represented by Formula 1 and an aprotic organic solvent with a dielectric constant of 10 or less, which can form a surface protective film capable of preventing collapse of the pattern even in a wet cleaning process of fine patterns with high aspect ratios, thereby providing a method for manufacturing a semiconductor device with an improved semiconductor manufacturing yield.

Find Patent Forward Citations

Kim, Hye. (2026). Cleaning agent composition for substrate for semiconductor devices and method for cleaning substrate for semiconductor devices using the same (U.S. Patent No. 12760248). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12760248

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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