The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jan. 23, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Keunwook Shin, Yongin-si, KR;
Sangwon Kim, Seoul, KR;
Kyung-Eun Byun, Seongnam-si, KR;
Joungeun Yoo, Seongnam-si, KR;
Eunkyu Lee, Yongin-si, KR;
Changseok Lee, Gwacheon-si, KR;
Alum Jung, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 20/44 (2026.01); H10W 20/43 (2026.01);
U.S. Cl.
CPC ...
H10W 20/4462 (2026.01); H10W 20/43 (2026.01); H10W 20/4405 (2026.01); H10W 20/4421 (2026.01); H10W 20/4432 (2026.01); H10W 20/4441 (2026.01);
Abstract
An interconnect structure may include a dielectric layer including a trench, a conductive wiring including graphene filling an inside of the trench, and a liner layer in contact with at least one surface of the conductive wiring and including a metal.