The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Mar. 09, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masato Sakamoto, Nirasaki City, JP;

Tadahiro Ishizaka, Nirasaki City, JP;

Issei Takeyasu, Nirasaki City, JP;

Kohichi Satoh, Nirasaki City, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/00 (2026.01); C23C 16/02 (2006.01); C23C 16/16 (2006.01); C23C 16/448 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
H10W 20/056 (2026.01); C23C 16/0227 (2013.01); C23C 16/16 (2013.01); C23C 16/4481 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01);
Abstract

An embedding method includes: preparing a substrate including an insulating film formed with a recess and a metal film exposed from a bottom of the recess; embedding a first ruthenium film from the bottom of the recess to a middle of the recess by CVD using a ruthenium-containing gas while heating the substrate to a first temperature; and embedding a second ruthenium film over the first ruthenium film in the recess by CVD using the ruthenium-containing gas while heating the substrate to a second temperature lower than the first temperature.


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Sakamoto, Masato. (2026). Embedding method and processing system (U.S. Patent No. 12751259). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751259

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