The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Nov. 16, 2023
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Daniel Fulford, Albany, NY (US);
Mark I. Gardner, Austin, TX (US);
H. Jim Fulford, Marianna, FL (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01B 21/20 (2006.01); H10P 72/00 (2026.01); H10P 74/20 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0616 (2026.01); G01B 21/20 (2013.01); H10P 74/203 (2026.01);
Abstract
A wafer measurement stage for supporting a semiconductor wafer for surface geometry measurements. The wafer measurement stage includes a support body having a planar surface configured to face a wafer which is supported by the wafer measurement stage, and a wafer contact structure provided on the planar surface. The wafer contact structure is configured to contact a portion of a wafer such that the wafer is supported in an elevated position relative to the planar surface and to control gravity effects at non-contact portions of the wafer.