The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Sep. 06, 2022
United Semiconductor (Xiamen) Co., Ltd., Xiamen, CN;
Chen Feng Wang, Shamen City, CN;
Ching-Shu Lo, Singapore, SG;
Tsung Che Lin, Singapore, SG;
Sen-Chih Chang, Tainan City, TW;
Wen Yi Tan, Xiamen, CN;
United Semiconductor (Xiamen) Co., Ltd., Xiamen, CN;
Abstract
The invention provides a method for detecting the back surface of a wafer, which comprises providing a wafer and performing a detection step on the back surface of the wafer, wherein the detection step comprises capturing a gray scale map of the back surface of the wafer, finding out at least one defect of the back surface of the wafer according to a deviation of the gray scale map, and transmitting the data of the at least one defect back to a system, and the system performs a judgment step according to the data of the at least one defect.