The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jul. 01, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Swadesh Choudhary, Mountain View, CA (US);

Debendra Das Sharma, Saratoga, CA (US);

Narasimha Lanka, Dublin, CA (US);

Lakshmipriya Seshan, Sunnyvale, CA (US);

Gerald Pasdast, San Jose, CA (US);

Zuoguo Wu, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 13/42 (2006.01); G06F 11/10 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4221 (2013.01); G06F 11/1004 (2013.01); G06F 2213/0026 (2013.01);
Abstract

A die-to-die (D2D) adapter couples to a protocol layer block using a first interface to couple to a protocol layer block and couples to a physical layer (PHY) block using a second interface. The D2D adapter is to determine parameters of a D2D link to couple a first die to a second die and select, based on the parameters, a particular one of a plurality of different data formats for use on the D2D link. Protocol layer data is received at the D2D adapter over the first interface from the protocol layer block. The D2D adapter passes the protocol layer data over the second interface to the PHY block based on the particular data format.


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