The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
Feb. 28, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
I-Hsieh Wong, Hsinchu, TW;
Yen-Ting Chen, Hsinchu, TW;
Wei-Yang Lee, Hsinchu, TW;
Feng-Cheng Yang, Hsinchu, TW;
Yen-Ming Chen, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10D 30/0245 ; H10D 64/017 ; H10D 30/024 ; H10D 64/667 ; H10D 64/691 ; H10D 30/601 ; H10D 30/62 ; H10D 84/0135 ; H10D 84/0158 ; H10D 30/795 ; H10D 62/151 ; H10D 62/822 ; H10D 30/797 ; H10D 30/0227 ; H10D 84/038 ; H10D 84/014 ; H10P 76/2041 ; H10P 14/6306 ; H10P 14/6322 ; H10P 50/642 ; H10P 50/242 ; H10P 50/283 ;
Wong, I-Hsieh. (2026). Methods of forming semiconductor devices (U.S. Patent No. 12713635). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713635
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile