The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Aug. 21, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 20/25 (2023.01);
U.S. Cl.
CPC ...
H10B 20/25 (2023.02);
Abstract
An integrated circuit (IC) device includes a substrate, a bottom semiconductor device over the substrate, and a top semiconductor device over the bottom semiconductor device in a thickness direction of the substrate. The top semiconductor device and the bottom semiconductor device are of a same conductivity type.
Quick Actions:
Chang, Meng-Sheng. (2026). Integrated circuit device, memory device, and method of manufacturing (U.S. Patent No. 12701697). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12701697
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile