The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Aug. 14, 2023
Applicants:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dct Material Llc., Suwon, KR;
Inventors:
Chawon Koh, Suwon-si, KR;
Yeon Hee Seong, Suwon-si, KR;
Tsunehiro Nishi, Suwon-si, KR;
Geun Su Lee, Suwon-si, KR;
Sung Jae Jung, Suwon-si, KR;
Moo Hyun Koh, Suwon-si, KR;
Ji Young Park, Suwon-si, KR;
Seungyeol Baek, Suwon-si, KR;
Assignees:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
DCT MATERIAL LLC., Chungcheongbuk-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); C07F 7/22 (2006.01); C07F 9/6596 (2006.01); G03F 7/075 (2006.01); G03F 7/16 (2006.01); G03F 7/38 (2006.01); H10P 76/20 (2026.01);
U.S. Cl.
CPC ...
G03F 7/0045 (2013.01); C07F 7/2224 (2013.01); C07F 9/6596 (2013.01); G03F 7/0757 (2013.01); G03F 7/168 (2013.01); G03F 7/38 (2013.01); H10P 76/2041 (2026.01);
Abstract
The present disclosure relates to a semiconductor photoresist composition including an organometallic compound represented by Chemical Formula 1 and a solvent, and a method of forming patterns by using the semiconductor photoresist composition.