The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

May. 25, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Albert M. Young, Fishkill, NY (US);

Brent A. Anderson, Jericho, VT (US);

Julien Frougier, Albany, NY (US);

Kangguo Cheng, Schenectady, NY (US);

Chanro Park, Clifton Park, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10W 20/435 (2026.01); H10D 30/6713 (2025.01); H10D 30/6757 (2025.01); H10D 62/118 (2025.01);
Abstract

A microelectronic structure including a stacked device region, where stacked device region is comprised of a plurality of top devices and a plurality of bottom devices. Each of the plurality of top devices includes at least one top source/drain. Each of the plurality of bottom devices includes at least one bottom source/drain. A gate cut region located adjacent to the stacked region and an interconnect located in the gate cut region. The interconnect is connected to at least two different devices located in the stacked device region.


Find Patent Forward Citations

Xie, Ruilong. (2026). Interconnect through gate cut for stacked fet device (U.S. Patent No. 12685136). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12685136

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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