The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Mar. 23, 2023
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Masami Oikawa, Iwate, JP;
Yuya Takamura, Iwate, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 30/40 (2026.01); C23C 16/40 (2006.01); C23C 16/56 (2006.01); H10D 64/01 (2025.01); H10P 95/00 (2026.01);
U.S. Cl.
CPC ...
H10P 30/40 (2026.01); C23C 16/401 (2013.01); C23C 16/56 (2013.01); H10P 95/94 (2026.01); H10D 64/0134 (2026.01);
Abstract
A substrate processing method includes: preparing a substrate having a target film on a surface; forming a barrier film that covers the target film; supplying a deuterium gas and an oxygen gas to the target film covered with the barrier film, thereby implanting deuterium into the target film; and removing the barrier film after the deuterium is implanted into the target film.