The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Apr. 19, 2022
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Bong Woong Mun, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Szu Huat Goh, Singapore, SG;

Jeoung Mo Koo, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 1/00 (2025.01); H10D 1/68 (2025.01); H10W 20/40 (2026.01); H10W 44/00 (2026.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 70/63 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
H10D 1/042 (2025.01); H10D 1/716 (2025.01); H10W 20/496 (2026.01); H10W 44/601 (2026.01); H10W 70/05 (2026.01); H10W 70/095 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 72/00 (2026.01); H10W 74/016 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 90/701 (2026.01); H10W 70/635 (2026.01); H10W 90/293 (2026.01);
Abstract

An electronic device is provided, the device comprising an interposer including a dielectric material and an interconnect structure. An integrated circuit chip may be arranged over the interposer. A galvanic capacitor may be spaced from the integrated circuit chip. The galvanic capacitor having a first electrode and a second electrode. The first electrode of the galvanic capacitor may be coupled to the integrated circuit chip. A molding material may be arranged over the integrated circuit chip and the galvanic capacitor, whereby the integrated circuit chip may be spaced from the galvanic capacitor by at least a portion of the molding material.


Find Patent Forward Citations

Loading…