The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Dec. 30, 2022
Intel Corporation, Santa Clara, CA (US);
Jeremy D. Ecton, Gilbert, AZ (US);
Brandon Christian Marin, Gilbert, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Technologies for a vertically interconnected glass layer architecture is disclosed. In the illustrative embodiment, an integrated circuit component includes several integrated circuit dies and a glass layer. Integrated circuit dies are positioned both above and below the glass layer. The glass layer has a bridge die embedded in a cavity. The bridge die provides interconnects between the various dies and to other components off of the integrated circuit component. The glass layer can enable three-dimensional heterogeneous integration, allowing for fine pitch connections between dies.