The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Dec. 14, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Jingyun Zhang, Albany, NY (US);

Reinaldo Vega, Mahopac, NY (US);

Alexander Reznicek, Troy, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 30/67 (2025.01); H10D 62/13 (2025.01); H10D 30/01 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6729 (2025.01); H10D 62/151 (2025.01); H10D 64/01 (2025.01); H10D 64/017 (2025.01); H10D 30/031 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01);
Abstract

A semiconductor structure includes a source/drain region having a recessed portion. The semiconductor structure further includes a metal contact having a first portion and a second portion. The first portion of the metal contact has a first width and the second portion of the metal contact has a second width greater than the first width. At least a portion of the second portion of the metal contact is disposed in the recessed portion of the source/drain region.


Find Patent Forward Citations

Xie, Ruilong. (2026). Semiconductor structures with wrap-around contact structure (U.S. Patent No. 12672309). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12672309

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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