The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jun. 16, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Michael Carcasi, Austin, TX (US);

Sean Berglund, Austin, TX (US);

Ankur Agarwal, Austin, TX (US);

Joshua Hooge, Austin, TX (US);

David Hetzer, Albany, NY (US);

Robert Brandt, Albany, NY (US);

Steven Gueci, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 74/00 (2026.01); G01B 11/22 (2006.01); G01P 5/26 (2006.01);
U.S. Cl.
CPC ...
H10P 74/238 (2026.01); G01P 5/26 (2013.01); G01B 11/22 (2013.01);
Abstract

Embodiments of processing systems and methods are provided to control operational parameter(s) of a spin-on process based on a fluid height and/or a fluid velocity of a processing liquid dispensed onto a surface of a spinning semiconductor substrate. The disclosed embodiments determine the fluid height and/or the fluid velocity of the processing liquid by: (a) monitoring an intensity of light, which is transmitted through the processing liquid as the processing liquid flows across the surface of the spinning substrate or leaves the periphery of the spinning substrate, or (b) monitoring how long it takes for the processing liquid to flow from a dispensed location to the periphery of the spinning substrate. Once determined, the fluid velocity is used to control one or more operational parameters of a spin-on process.


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