The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Jan. 25, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kazuya Nagaseki, Miyagi, JP;

Kazuki Moyama, Miyagi, JP;

Shinji Himori, Miyagi, JP;

Masanobu Honda, Miyagi, JP;

Satoru Teruuchi, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/3244 (2013.01); H10P 72/722 (2026.01); H01J 2237/2065 (2013.01);
Abstract

A processing method for performing plasma processing on a substrate includes placing a temperature adjustment target onto a support surface of a substrate support in a decompressible processing, forming a heat transfer layer by supplying, through the substrate support, a heat transfer medium including at least one of a liquid medium or a solid medium with fluidity to between the support surface of the substrate support and a back surface of the temperature adjustment target, performing plasma processing on the substrate on the support surface on which the heat transfer layer is formed, and separating the temperature adjustment target from the support surface after the plasma processing.


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