The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Dec. 29, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Takeshi Nogami, Schenectady, NY (US);

Son Nguyen, Schenectady, NY (US);

Cornelius Brown Peethala, Slingerlands, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10W 20/00 (2026.01); H10W 20/46 (2026.01);
U.S. Cl.
CPC ...
H10W 20/425 (2026.01); H10W 20/039 (2026.01); H10W 20/063 (2026.01); H10W 20/072 (2026.01); H10W 20/46 (2026.01);
Abstract

An integrated circuit configuration with graphene coated metal interconnect structures and airgap structures between the graphene coated metal interconnect structures and method for fabrication of the integrated circuit configuration may be provided. The structure may include a metal interconnect structure in contact with an electrode upon a substrate fabricated through subtractive metal reactive ion etching. The metal interconnect structure may have a thin coating of hydrophobic graphene surrounding the exterior of the metal interconnect structure to prevent oxidation of the metal interconnect and to prevent parasitic capacitance. The structure may further include one or more air gap structures formed upon the substrate and in between the graphene coated metal interconnect structures and capped with a dielectric layer.


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