The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Jan. 15, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Du Zhang, Albany, NY (US);

Shihsheng Chang, Albany, NY (US);

Toru Hisamatsu, Albany, NY (US);

Koki Mukaiyama, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/24 (2026.01); H10P 50/20 (2026.01); H10P 50/28 (2026.01); H10P 76/40 (2026.01); H10P 95/00 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10P 50/244 (2026.01); H10P 50/20 (2026.01); H10P 50/242 (2026.01); H10P 50/28 (2026.01); H10P 76/405 (2026.01); H10P 95/066 (2026.01); H10W 20/076 (2026.01);
Abstract

Various embodiments of improved process flows and methods are provided herein for etching high aspect ratio (HAR) features in carbon-containing hard mask layers. In the disclosed embodiments, the improved process flows and methods combine sidewall passivation and mask de-clogging steps in a single plasma process step to improve throughput when etching HAR features (such as vias, contact holes, trenches, etc.) within a carbon-containing hard mask layer. In doing so, the improved process flows and methods disclosed herein protect the sidewall surfaces of the carbon-containing hard mask layer and prevent bowing during the HAR etch process, while also reducing processing time and improving throughput.


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