The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Apr. 04, 2023
Applicant:

Hua Hong Semiconductor (Wuxi) Limited, Wuxi, CN;

Inventors:

Hongfeng Jin, Wuxi, CN;

Hongxu Yang, Wuxi, CN;

Hualun Chen, Wuxi, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H10D 1/00 (2025.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10D 1/042 (2025.01); H10D 1/716 (2025.01);
Abstract

The present disclosure provides a digital isolator structure and a method for forming the same. The method includes: providing a substrate; forming a first electrode plate on a surface of the substrate and forming a dielectric layer on the first electrode plate; etching the dielectric layer until the first electrode plate is exposed to form a deep trench in the dielectric layer; forming a connect layer on a bottom and a side surface of the deep trench and forming an insulating layer on at least a part of a surface of the connect layer; forming a lead-out electrode layer and a second electrode plate on a surface of the dielectric layer. The lead-out electrode layer is also disposed on a top surface of the connect layer. The method can reduce process steps and save cost of conductive materials.


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