The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Jun. 10, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Kisik Choi, Watervliet, NY (US);

Somnath Ghosh, Clifton Park, NY (US);

Julien Frougier, Albany, NY (US);

Stuart Sieg, Albany, NY (US);

Kevin Shawn Petrarca, Newburgh, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10W 20/00 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/427 (2026.01); H10W 20/074 (2026.01); H10W 20/082 (2026.01); H10W 20/089 (2026.01); H10W 20/42 (2026.01); H10W 20/435 (2026.01);
Abstract

A semiconductor structure including a middle-of-line contact, a backside power rail, and a contact via extending between the middle-of-line contact and the backside power rail, wherein the contact via comprises a first portion having a negative tapered profile and a second portion having a positive tapered profile.


Find Patent Forward Citations

Xie, Ruilong. (2026). Via connection to backside power delivery network (U.S. Patent No. 12616019). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12616019

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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