The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Mar. 26, 2024
Winbond Electronics Corp., Taichung City, TW;
Che-Jui Hsu, Taichung City, TW;
Ying-Fu Tung, Taichung City, TW;
Chun-Sheng Lu, Taichung City, TW;
Mu-Lin Li, Taichung City, TW;
Winbond Electronics Corp., Taichung City, TW;
Abstract
An isolation structure, comprising: an isolation material layer, filled in a trench of a substrate; and a protection layer, having two portions extending from a topmost surface of the substrate to a top surface of the isolation material layer across boundaries of the trench, and covering opposite edges of the isolation material layer, wherein the two portions of the protection layer are laterally spaced apart from each other, and the protection layer has an etching selectivity with respect to the isolation material layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile