The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Sep. 24, 2020
Applicants:

Kwansei Gakuin Educational Foundation, Hyogo, JP;

Toyota Tsusho Corporation, Nagoya, JP;

Inventors:

Tadaaki Kaneko, Sanda, JP;

Kiyoshi Kojima, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H10D 62/832 (2025.01); C30B 29/36 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02378 (2013.01); H01L 21/02529 (2013.01); H01L 21/0262 (2013.01); H10D 62/8325 (2025.01); C30B 29/36 (2013.01);
Abstract

An object of the present invention is to provide a high-quality SiC semiconductor device. In order to solve the above problem, the present invention comprises a method for producing a SiC semiconductor device, comprising a growth step of forming a growth layer on a workpiece comprising SiC single crystals, a device formation step of forming at least a portion of a SiC semiconductor device in the growth layer, and a separation step of separating at least a portion of the SiC semiconductor device from the workpiece.


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