The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
May. 16, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yao-Ren Kuo, Hsinchu, TW;
Chih-Wei Wen, Hsinchu, TW;
Kun-Lung Hsieh, Hsinchu, TW;
Tzu Han Liu, Hsinchu, TW;
Hung-Jui Chang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); G01N 21/88 (2006.01); G03F 7/20 (2006.01); H10F 39/15 (2025.01);
U.S. Cl.
CPC ...
H10F 39/026 (2025.01); G03F 7/2004 (2013.01); H10F 39/15 (2025.01); G01N 2021/8829 (2013.01); G01N 2021/8832 (2013.01);
Abstract
Pellicles are inspected by projecting a light pattern thereon and monitoring the reflected light by CCD module or the like. Software-based inspection of the reflected pattern recognizes any distortions in the pattern or contamination, and thus identifies wrinkles or other defects in the pellicle prior to use in the manufacturing process. Recognition of defects and replacement will avoid instances of pellicle rupture thereby avoiding damage to wafers being patterned.