The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Feb. 17, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masato Hamada, Kumamoto, JP;

Masami Akimoto, Koshi, JP;

Masatoshi Shiraishi, Kumamoto, JP;

Kazuyuki Goto, Koshi, JP;

Satoshi Kaneko, Koshi, JP;

Kazuki Motomatsu, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/08 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25D 17/10 (2006.01); C25D 21/08 (2006.01);
U.S. Cl.
CPC ...
C25D 5/08 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 17/10 (2013.01); C25D 21/08 (2013.01);
Abstract

A plating apparatusincludes a substrate holder, a first electrode, a second electrode and a voltage applying unit. The substrate holderis configured to hold a substrate. The first electrode is electrically connected to the substrate. The second electrode is configured to scan with respect to a front surface of the substrate. The voltage applying unitis configured to apply a voltage between the first electrode and the second electrode. A first discharge openingconfigured to discharge a plating liquid Land a second discharge openingconfigured to discharge a cleaning liquid Lare formed in a bottom surfaceof the second electrode.


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