The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Nov. 09, 2021
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Kohei Ota, Tokyo, JP;
Nobuyuki Takada, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/10 (2012.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
B24B 37/107 (2013.01); B24B 37/042 (2013.01); H01L 21/30625 (2013.01);
Abstract
To suppress damage to a surface to be polished of a substrate and improve a polishing rate. A substrate processing apparatus includes a tablefor supporting a substrate WF, a pad holderfor holding a polishing padfor polishing the substrate WF supported by the table, a nozzlefor supplying a polishing liquid around the pad holder, and a pad rotation mechanism for rotating the pad holder. The pad holderincludes a discharge hole-formed in the center of a holding surface-configured to hold the polishing padand a discharge passage-communicated with an outside of the pad holderfrom the discharge hole-