The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Aug. 16, 2022
Applicant:

Carl Zeiss Smt Gmbh, Oberkochen, DE;

Inventors:

Alex Buxbaum, San Ramon, CA (US);

Eugen Foca, Ellwangen, DE;

Chuong Huynh, Quincy, MA (US);

Dmitry Klochkov, Schwaebisch Gmuend, DE;

Thomas Korb, Schwaebisch Gmuend, DE;

Jens Timo Neumann, Aalen, DE;

Baohua Niu, Livermore, CA (US);

Assignee:

Carl Zeiss SMT GmbH, Oberkochen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G06T 7/00 (2017.01); G06T 7/30 (2017.01); G06T 7/50 (2017.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01); H01J 37/305 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G06T 7/0004 (2013.01); G06T 7/30 (2017.01); G06T 7/50 (2017.01); H01J 37/222 (2013.01); H01J 37/28 (2013.01); H01J 37/3053 (2013.01); G06T 2207/10028 (2013.01); G06T 2207/30148 (2013.01); H01J 2237/226 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/2803 (2013.01);
Abstract

The present disclosure relates to dual beam device and three-dimensional circuit pattern inspection techniques by cross sectioning of inspection volumes with large depth extension exceeding 1 μm below the surface of a semiconductor wafer, as well as methods, computer program products and apparatuses for generating 3D volume image data of a deep inspection volume inside a wafer without removal of a sample from the wafer. The disclosure further relates to 3D volume image generation and cross section image alignment methods utilizing a dual beam device for three-dimensional circuit pattern inspection.


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