The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Apr. 11, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Shih-Yao Lin, New Taipei, TW;

Kuei-Yu Kao, Hsinchu, TW;

Chih-Han Lin, Hsinchu, TW;

Ming-Ching Chang, Hsinchu, TW;

Chao-Cheng Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 64/01 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H10D 30/024 (2025.01); H10D 30/0243 (2025.01); H10D 30/62 (2025.01); H10D 30/6219 (2025.01); H10D 64/017 (2025.01); H10D 64/518 (2025.01); H10D 84/0142 (2025.01); H10D 84/0158 (2025.01);
Abstract

A method includes depositing a dummy gate dielectric layer over a semiconductor region, depositing a dummy gate electrode layer, and performing a first etching process. An upper portion of the dummy gate electrode layer is etched to form an upper portion of a dummy gate electrode. The method further includes forming a protection layer on sidewalls of the upper portion of the dummy gate electrode, and performing a second etching process. A lower portion of the dummy gate electrode layer is etched to form a lower portion of the dummy gate electrode. A third etching process is then performed to etch the lower portion of the dummy gate electrode using the protection layer as an etching mask. The dummy gate electrode is tapered by the third etching process. The protection layer is removed, and the dummy gate electrode is replaced with a replacement gate electrode.


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