The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Feb. 28, 2023
Zhuhai Access Semiconductor Co., Ltd, Guangdong, CN;
Xianming Chen, Guangdong, CN;
Jindong Feng, Guangdong, CN;
Benxia Huang, Guangdong, CN;
Gao Huang, Guangdong, CN;
Juchen Huang, Guangdong, CN;
Zhuhai ACCESS Semiconductor Co., Ltd, Guangdong, CN;
Abstract
A carrier plate for preparing a package substrate according to an embodiment includes a dielectric layer, a seed layer in the dielectric layer, and a copper pillar layer on the seed layer. A bottom end of the seed layer is higher than a lower surface of the dielectric layer. A top end of the copper pillar layer is lower than an upper surface of the dielectric layer. The upper and lower surfaces of the dielectric layer are respectively provided with a first metal layer and a second metal layer.