The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jan. 17, 2025
Resonac Corporation, Tokyo, JP;
Hideo Nakako, Tokyo, JP;
Toshiaki Tanaka, Tokyo, JP;
Dai Ishikawa, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Michiko Natori, Tokyo, JP;
Resonac Corporation, Tokyo, JP;
Abstract
A copper paste for forming a wick of a heat pipe contains copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium. A method for forming a wick of a heat pipe comprises a step of printing the copper paste and a step of sintering the copper paste. A heat pipe comprises a wick including a sintered body of the copper paste.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile