The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Sep. 23, 2021
Intel Corporation, Santa Clara, CA (US);
Jeremy D. Ecton, Gilbert, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Oscar Ojeda, Chandler, AZ (US);
Bai Nie, Chandler, AZ (US);
Brandon C. Marin, Gilbert, AZ (US);
Gang Duan, Chandler, AZ (US);
Jacob Vehonsky, Gilbert, AZ (US);
Onur Ozkan, Scottsdale, AZ (US);
Nicholas S. Haehn, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a plurality of stacked layers. In an embodiment, a first trace is on a first layer, wherein the first trace has a first thickness. In an embodiment, a second trace is on the first layer, wherein the second trace has a second thickness that is greater than the first thickness. In an embodiment, a second layer is over the first trace and the second trace.