The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Dec. 21, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kaveh Hosseini, Livermore, CA (US);

Omkar Karhade, Chandler, AZ (US);

Xiaoqian Li, Chandler, AZ (US);

Chia-Pin Chiu, Tempe, AZ (US);

Finian G. Rogers, Newbridge, IE;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/122 (2006.01); G02B 6/12 (2006.01); G02B 6/30 (2006.01);
U.S. Cl.
CPC ...
G02B 6/122 (2013.01); G02B 6/12004 (2013.01); G02B 6/30 (2013.01); G02B 2006/12102 (2013.01);
Abstract

An electronic device may include a photonic integrated circuit (PIC) coupled with a substrate. The PIC may communicate a photonic signal with one or more optical fibers. The PIC may process the photonic signal into an electronic signal. The PIC may extend between a first end and a second end. An electronic integrated circuit (EIC) may be coupled with the substrate. The EIC may communicate with the PIC. The EIC may transmit the electronic signal to the PIC. The EIC may receive the electronic signal from the PIC. The electronic device may include a lens assembly. The lens assembly may be coupled with the first end of the PIC. In an example, optical interconnects of the PIC are aligned with the lens assembly such that the lens assembly is configured to transmit the photonic signal communicated between PIC and the optical fibers.


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