The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Apr. 26, 2024
Tokyo Electron Limited, Tokyo, JP;
Ivan Maleev, Fremont, CA (US);
Andrej Mitrovic, Chandler, AZ (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of measuring thin-film thickness, overlay, and wafer-to-wafer bonding overlay, including providing a substrate on a handling stage configured for rotation; illuminating the substrate with a broadband illumination beam; obtaining a first set of reflectivity spectra of a first linear region of the substrate via a hyperspectral broom camera; incrementally rotating the substrate by an angle of rotation via the handling stage; obtaining a set of reflectivity spectra of a linear region of the substrate via the hyperspectral broom camera after each incremental rotation; and determining a thickness distribution of the substrate based on sets of reflectivity spectra obtained by the hyperspectral broom camera, wherein each set of reflectivity spectra includes individual intensities of a plurality of wavelengths of light.